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CPC Subgroup
C23D 13/02

Removing defects by local re-melting of the enamel; Adjusting the shape

Full Title

After-treatment of the enamelled articles > Removing defects by local re-melting of the enamel; Adjusting the shape

Filing statistics

CPC C23D 13/02 belongs to the parent subclass C23D, which recorded 1,358 patent applications worldwide between 2013 and 2023. Annual filings grew from 59 in 2013 to 93 in 2023 (+58%), peaking at 184 applications in 2020. The most active applicants in class C23 are APPLIED MATERIALS (10,596 applications), TOKYO ELECTRON (5,229 applications) and LAM RESEARCH CORPORATION (3,622 applications).

Source: EPO PATSTAT, worldwide filings

Top Applicants

Top 10 applicants by patent filingsfor class C23, 2013–2023, worldwide · Source: EPO PATSTAT

  1. APPLIED MATERIALS US 10,596
  2. TOKYO ELECTRON JP 5,229
  3. LAM RESEARCH CORPORATION US 3,622
  4. NIPPON STEEL CORPORATION JP 3,171
  5. JFE STEEL JP 3,128
  6. ASM IP HOLDING NL 2,722
  7. ARCELORMITTAL LU 2,481
  8. TOKYO ELECTRON 2,359
  9. APPLIED MATERIALS 2,284
  10. CHINESE ACADEMY OF SCIENCES 2,110