G11B 7/12 Heads, e.g. forming of the optical beam spot or modulation of the optical beam (disposition or mounting of head elements within housing or with provision for moving of light source, optical beam or detector, irrelevant to the transducing method G11B7/08 )
Full Title
Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation , reproducing using an optical beam at lower power ; Record carriers therefor (G11B11/00, G11B13/00 take precedence) > Heads, e.g. forming of the optical beam spot or modulation of the optical beam (disposition or mounting of head elements within housing or with provision for moving of light source, optical beam or detector, irrelevant to the transducing method G11B7/08 )
Filing statistics
CPC G11B 7/12 belongs to the parent subclass G11B, which recorded 59,347 patent applications worldwide between 2013 and 2023. Annual filings declined from 7,949 in 2013 to 3,480 in 2023 (-56%). The most active applicants in class G11 are MICRON TECHNOLOGY (12,397 applications), SAMSUNG ELECTRONICS COMPANY (12,238 applications) and SK HYNIX (11,371 applications).
Source: EPO PATSTAT, worldwide filings
8 direct subcodes
Child Classifications
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- G11B 7/121 Protecting the head, e.g. against dust or impact with the record carrier
- G11B 7/122 Flying-type heads, e.g. analogous to Winchester type in magnetic recording
- G11B 7/123 Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
- G11B 7/125 Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
- G11B 7/13 Optical detectors therefor
- G11B 7/135 Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B 7/14 specially adapted to record on, or to reproduce from, more than one track simultaneously
- G11B 7/22 Apparatus or processes for the manufacture of optical heads, e.g. assembly
Top Applicants
Top 10 applicants by patent filingsfor class G11, 2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961