G11B 7/12 Heads, e.g. forming of the optical beam spot or modulation of the optical beam (disposition or mounting of head elements within housing or with provision for moving of light source, optical beam or detector, irrelevant to the transducing method G11B7/08 )
Introduced: September 1968
Title
Titles differ between systems:
IPC: Heads, e.g. forming of the optical beam spot or modulation of the optical beam
CPC: Heads, e.g. forming of the optical beam spot or modulation of the optical beam (disposition or mounting of head elements within housing or with provision for moving of light source, optical beam or detector, irrelevant to the transducing method G11B7/08 )
Full Title
Full titles differ between systems:
Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor > Heads, e.g. forming of the optical beam spot or modulation of the optical beam
Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation , reproducing using an optical beam at lower power ; Record carriers therefor (G11B11/00, G11B13/00 take precedence) > Heads, e.g. forming of the optical beam spot or modulation of the optical beam (disposition or mounting of head elements within housing or with provision for moving of light source, optical beam or detector, irrelevant to the transducing method G11B7/08 )
Additional Content IPC
Glossary
Head heads includes any means for converting sinusoidal or non-sinusoidal electric wave-forms into various of the optical condition of at least the adjacent surface of the record carrier, or vice versa.
Limiting references
Disposition or mounting of head elements within housing or with provision for moving of light source, optical beam or detector, irrelevant to the transducing method
Application references
Associated working of cameras or projectors with sound-recording or -reproducing means Sound-recording combined with cinematography Subtractive cinematographic processes combined with sound-recording
IPC and CPC are identically structured here. All 8 subcodes exist in both systems.
Child Classifications
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- G11B 7/121 Protecting the head, e.g. against dust or impact with the record carrier since 2012 IPC+CPC Available in IPC and CPC
- G11B 7/122 Flying-type heads, e.g. analogous to Winchester type in magnetic recording since 2012 IPC+CPC Available in IPC and CPC
- G11B 7/123 Integrated head arrangements, e.g. with source and detectors mounted on the same substrate since 2012 IPC+CPC Available in IPC and CPC
- G11B 7/125 Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces since 1985 IPC+CPC Available in IPC and CPC
- G11B 7/135 Means for guiding the beam from the source to the record carrier or from the record carrier to the detector since 1985 IPC+CPC Available in IPC and CPC
- G11B 7/14 specially adapted to record on, or to reproduce from, more than one track simultaneously IPC+CPC Available in IPC and CPC
- G11B 7/22 Apparatus or processes for the manufacture of optical heads, e.g. assembly IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 10,574
- SK HYNIX KR 9,138
- SAMSUNG ELECTRONICS COMPANY KR 9,004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
- INTEL CORPORATION US 2,952
- SANDISK TECHNOLOGIES US 2,905
- WESTERN DIGITAL TECHNOLOGIES US 2,630
- TOSHIBA CORPORATION JP 2,593
- SEAGATE TECHNOLOGY US 2,472
Top Applicants (CPC)
Class G11,2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 12,397
- SAMSUNG ELECTRONICS COMPANY KR 12,238
- SK HYNIX KR 11,371
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 4,601
- INTEL CORPORATION US 3,874
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,866
- SANDISK TECHNOLOGIES US 3,151
- SK HYNIX 3,143
- SAMSUNG ELECTRONICS COMPANY 3,073
- WESTERN DIGITAL TECHNOLOGIES US 2,961