G11B 7/12 Heads, e.g. forming of the optical beam spot or modulation of the optical beam
Introduced: September 1968
Last revised: January 2012
Full Title
Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor > Heads, e.g. forming of the optical beam spot or modulation of the optical beam
Classification Context
- Section:
- PHYSICS
- Class:
- INFORMATION STORAGE
- Subclass:
- INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
Additional Content
Glossary
Head heads includes any means for converting sinusoidal or non-sinusoidal electric wave-forms into various of the optical condition of at least the adjacent surface of the record carrier, or vice versa.
Limiting references
Disposition or mounting of head elements within housing or with provision for moving of light source, optical beam or detector, irrelevant to the transducing method
Application references
Associated working of cameras or projectors with sound-recording or -reproducing means Sound-recording combined with cinematography Subtractive cinematographic processes combined with sound-recording
8 direct subcodes
Child Classifications
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- G11B 7/121 Protecting the head, e.g. against dust or impact with the record carrier
- G11B 7/122 Flying-type heads, e.g. analogous to Winchester type in magnetic recording
- G11B 7/123 Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
- G11B 7/125 Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
- G11B 7/13 Optical detectors therefor
- G11B 7/135 Means for guiding the beam from the source to the record carrier or from the record carrier to the detector
- G11B 7/14 specially adapted to record on, or to reproduce from, more than one track simultaneously
- G11B 7/22 Apparatus or processes for the manufacture of optical heads, e.g. assembly
Top Applicants
Top 10 applicants by patent filingsfor class G11, 2013–2023, worldwide · Source: EPO PATSTAT
- MICRON TECHNOLOGY US 10,574
- SK HYNIX KR 9,138
- SAMSUNG ELECTRONICS COMPANY KR 9,004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 3,739
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 3,443
- INTEL CORPORATION US 2,952
- SANDISK TECHNOLOGIES US 2,905
- WESTERN DIGITAL TECHNOLOGIES US 2,630
- TOSHIBA CORPORATION JP 2,593
- SEAGATE TECHNOLOGY US 2,472