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CPC Subgroup
H01R 13/46

Bases; Cases

Full Title

Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 > Bases; Cases

8 direct subcodes

Child Classifications

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  • H01R 13/514 composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
  • H01R 13/53 Bases or cases for heavy duty; Bases or cases with means for preventing corona or arcing
  • H01R 13/533 Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure (H01R13/52 takes precedence)

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080