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IPC Subgroup
H01R 13/46

Bases; Cases

Introduced: September 1968

Last revised: January 2006

Full Title

Details of coupling devices of the kinds covered by groups or > Bases; Cases

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC ELEMENTS
Subclass:
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

7 direct subcodes

Child Classifications

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  • H01R 13/5 formed as an integral body
  • H01R 13/514 formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
  • H01R 13/53 Bases or cases for heavy duty; Bases or cases with means for preventing corona or arcing
  • H01R 13/533 Bases or cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634