CPC Main Group
H01R 4/00 Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
Filing statistics
CPC H01R 4/00 belongs to the parent subclass H01R, which recorded 238,918 patent applications worldwide between 2013 and 2023. Annual filings grew from 16,339 in 2013 to 20,728 in 2023 (+27%), peaking at 26,812 applications in 2017. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).
Source: EPO PATSTAT, worldwide filings
14 direct subcodes
Child Classifications
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- H01R 4/01 Connections using shape memory materials, e.g. shape memory metal
- H01R 4/02 Soldered or welded connections
- H01R 4/04 using electrically conductive adhesives
- H01R 4/06 Riveted connections (by explosion H01R4/08)
- H01R 4/08 effected by an explosion
- H01R 4/10 effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R 4/22 End caps, i.e. of insulating or conductive material for covering or maintaining connections between wires entering the cap from the same end
- H01R 4/24 Connections using contact members penetrating or cutting insulation or cable strands
- H01R 4/26 Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact (; using shape memory materials H01R4/01)
- H01R 4/28 Clamped connections, spring connections (made by means of terminals specially adapted for contact with, or insertion into, printed circuits H01R12/00)
- H01R 4/56 one conductor screwing into another
- H01R 4/58 characterised by the form or material of the contacting members (H01R4/01 takes precedence)
- H01R 4/70 Insulation of connections (end caps H01R4/22)
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080