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DIFF Main Group
H01R 4/00

Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation

Introduced: January 1980

Of 14 combined children, 13 exist in both systems.

1 codes are CPC-only extensions.

6 shared codes have differing titles between IPC and CPC.

IPC defines codes here since 1980.

Child Classifications

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  • H01R 4/01 Connections using shape memory materials, e.g. shape memory metal since 2000 IPC+CPC Available in IPC and CPC
  • H01R 4/04 using electrically conductive adhesives since 1980 IPC+CPC Available in IPC and CPC
  • H01R 4/06 Riveted connections (by explosion H01R4/08) since 1980 IPC+CPC Available in IPC and CPC
  • H01R 4/08 effected by an explosion since 1980 IPC+CPC Available in IPC and CPC
  • H01R 4/22 End caps, i.e. of insulating or conductive material for covering or maintaining connections between wires entering the cap from the same end since 1980 IPC+CPC Available in IPC and CPC
  • H01R 4/26 Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact (; using shape memory materials H01R4/01) since 1980 IPC+CPC Available in IPC and CPC
  • H01R 4/54 CPC only CPC only
  • H01R 4/56 one conductor screwing into another since 1980 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634

Top Applicants (CPC)

Class H01,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 37,897
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
  3. APPLIED MATERIALS US 21,640
  4. LG ENERGY SOLUTION KR 20,770
  5. LG CHEM KR 19,835
  6. TOKYO ELECTRON JP 18,519
  7. ROBERT BOSCH DE 14,595
  8. INTEL CORPORATION US 13,580
  9. MURATA MANUFACTURING COMPANY JP 12,151
  10. SAMSUNG SDI COMPANY KR 12,080