DIFF Main Group
H01R 4/00 Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
Introduced: January 1980
Of 14 combined children, 13 exist in both systems.
1 codes are CPC-only extensions.
6 shared codes have differing titles between IPC and CPC.
IPC defines codes here since 1980.
Child Classifications
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- H01R 4/01 Connections using shape memory materials, e.g. shape memory metal since 2000 IPC+CPC Available in IPC and CPC
- H01R 4/10 effected solely by twisting, wrapping, bending, crimping, or other permanent deformation since 1980 IPC+CPC Available in IPC and CPC
- H01R 4/22 End caps, i.e. of insulating or conductive material for covering or maintaining connections between wires entering the cap from the same end since 1980 IPC+CPC Available in IPC and CPC
- H01R 4/24 Connections using contact members penetrating or cutting insulation or cable strands since 1980 IPC+CPC Available in IPC and CPC
- H01R 4/26 Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact (; using shape memory materials H01R4/01) since 1980 IPC+CPC Available in IPC and CPC
- H01R 4/28 Clamped connections, spring connections (made by means of terminals specially adapted for contact with, or insertion into, printed circuits H01R12/00) since 1980 IPC+CPC Available in IPC and CPC
- H01R 4/58 characterised by the form or material of the contacting members (H01R4/01 takes precedence) since 1980 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080