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IPC Main Group
H01R 4/00

Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation

Introduced: January 1980

Last revised: January 2006

Classification Context

Section:
ELECTRICITY
Class:
ELECTRIC ELEMENTS
Subclass:
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

Related Keywords

making connections to BUS-BARSTAGS providing electric connection

13 direct subcodes

Child Classifications

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  • H01R 4/01 Connections using shape memory materials, e.g. shape memory metal
  • H01R 4/02 Soldered or welded connections
  • H01R 4/04 using electrically conductive adhesives
  • H01R 4/06 Riveted connections
  • H01R 4/08 effected by an explosion
  • H01R 4/22 End caps, i.e. caps of insulating or conductive material for covering or maintaining connections between wires entering the cap from the same end
  • H01R 4/26 Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
  • H01R 4/56 one conductor screwing into another

Top Applicants

Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT

  1. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
  2. SAMSUNG ELECTRONICS COMPANY KR 42,206
  3. LG CHEM KR 21,383
  4. APPLIED MATERIALS US 20,441
  5. LG ENERGY SOLUTION KR 20,279
  6. SAMSUNG DISPLAY KR 19,725
  7. CHINESE ACADEMY OF SCIENCES 19,400
  8. TOYOTA MOTOR CORPORATION 18,819
  9. SGCC(STATE GRID CORPORATION OF CHINA) 18,082
  10. TOKYO ELECTRON JP 17,634