CPC Main Group
H01R 9/00 Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
Filing statistics
CPC H01R 9/00 belongs to the parent subclass H01R, which recorded 238,918 patent applications worldwide between 2013 and 2023. Annual filings grew from 16,339 in 2013 to 20,728 in 2023 (+27%), peaking at 26,812 applications in 2017. The most active applicants in class H01 are SAMSUNG ELECTRONICS COMPANY (37,897 applications), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (36,116 applications) and APPLIED MATERIALS (21,640 applications).
Source: EPO PATSTAT, worldwide filings
5 direct subcodes
Child Classifications
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- H01R 9/03 Connectors arranged to contact a plurality of the conductors of a multiconductor cable
- H01R 9/11 End pieces for multiconductor cables supported by the cable and for facilitating connections to other conductive members
- H01R 9/15 Connectors for wire wrapping
- H01R 9/16 Fastening of connecting parts to base or case; Insulating connecting parts from base or case
- H01R 9/22 Bases, e.g. strip, block, panel
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080