CPC Main Group
H01R 43/00 Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28)
17 direct subcodes
Child Classifications
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- H01R 43/01 for connecting unstripped conductors to contact members having insulation cutting edges
- H01R 43/02 for soldered or welded connections
- H01R 43/027 for connecting conductors by clips
- H01R 43/033 for wrapping or unwrapping wire connections
- H01R 43/04 for forming connections by deformation, e.g. crimping tool
- H01R 43/06 Manufacture of commutators
- H01R 43/10 Manufacture of slip-rings
- H01R 43/12 Manufacture of brushes
- H01R 43/14 Maintenance of current collectors, e.g. reshaping of brushes, cleaning of commutators
- H01R 43/16 for manufacturing contact members, e.g. by punching and by bending
- H01R 43/18 for manufacturing bases or cases for contact members
- H01R 43/20 for assembling or disassembling contact members with insulating base, case or sleeve
- H01R 43/26 for engaging or disengaging the two parts of a coupling device (structural association with two-part coupling device H01R13/629)
- H01R 43/28 for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
Top Applicants
Top 10 applicants by patent filingsfor class H01, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080