DIFF Main Group
H01R 9/00 Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
Introduced: September 1968
Additional Content IPC
Specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures
IPC and CPC are identically structured here. All 5 subcodes exist in both systems.
Child Classifications
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- H01R 9/03 Connectors arranged to contact a plurality of the conductors of a multiconductor cable since 1980 +1 CPC IPC+CPC Available in IPC and CPC
- H01R 9/11 End pieces for multiconductor cables supported by the cable and for facilitating connections to other conductive members since 1980 IPC+CPC Available in IPC and CPC
- H01R 9/16 Fastening of connecting parts to base or case; Insulating connecting parts from base or case IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 43,574
- SAMSUNG ELECTRONICS COMPANY KR 42,206
- LG CHEM KR 21,383
- APPLIED MATERIALS US 20,441
- LG ENERGY SOLUTION KR 20,279
- SAMSUNG DISPLAY KR 19,725
- CHINESE ACADEMY OF SCIENCES 19,400
- TOYOTA MOTOR CORPORATION 18,819
- SGCC(STATE GRID CORPORATION OF CHINA) 18,082
- TOKYO ELECTRON JP 17,634
Top Applicants (CPC)
Class H01,2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 37,897
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 36,116
- APPLIED MATERIALS US 21,640
- LG ENERGY SOLUTION KR 20,770
- LG CHEM KR 19,835
- TOKYO ELECTRON JP 18,519
- ROBERT BOSCH DE 14,595
- INTEL CORPORATION US 13,580
- MURATA MANUFACTURING COMPANY JP 12,151
- SAMSUNG SDI COMPANY KR 12,080