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PCE
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CPC Subgroup
H02K 9/10

by gaseous cooling medium flowing in closed circuit, a part of which is external to the machine casing

Full Title

Arrangements for cooling or ventilating (channels or ducts in parts of the magnetic circuit H02K1/20, H02K1/32; channels or ducts in or between conductors H02K3/22, H02K3/24) > by gaseous cooling medium flowing in closed circuit, a part of which is external to the machine casing

1 direct subcode

Child Classifications

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  • H02K 9/12 wherein the cooling medium circulates freely within the casing

Top Applicants

Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SGCC(STATE GRID CORPORATION OF CHINA) 24,515
  2. MITSUBISHI ELECTRIC CORPORATION JP 11,346
  3. SIEMENS DE 9,026
  4. ROBERT BOSCH DE 9,005
  5. SAMSUNG ELECTRONICS COMPANY KR 6,729
  6. GUANGDONG POWER GRID CORPORATION 5,740
  7. DENSO CORPORATION JP 5,077
  8. LG ELECTRONICS KR 5,041
  9. LG INNOTEK COMPANY KR 4,442
  10. TOYOTA MOTOR CORPORATION 4,349