CPC Main Group
H02K 9/00 Arrangements for cooling or ventilating (channels or ducts in parts of the magnetic circuit H02K1/20, H02K1/32; channels or ducts in or between conductors H02K3/22, H02K3/24)
9 direct subcodes
Child Classifications
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- H02K 9/02 by ambient air flowing through the machine
- H02K 9/08 by gaseous cooling medium circulating wholly within the machine casing (H02K9/10 takes precedence)
- H02K 9/10 by gaseous cooling medium flowing in closed circuit, a part of which is external to the machine casing
- H02K 9/14 wherein gaseous cooling medium circulates between the machine casing and a surrounding mantle
- H02K 9/19 for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
- H02K 9/22 by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
- H02K 9/24 Protection against failure of cooling arrangements, e.g. due to loss of cooling medium or due to interruption of the circulation of cooling medium
- H02K 9/26 Structural association of machines with devices for cleaning or drying cooling medium, e.g. with filters
- H02K 9/28 Cooling of commutators, slip-rings or brushes e.g. by ventilating
Top Applicants
Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 24,515
- MITSUBISHI ELECTRIC CORPORATION JP 11,346
- SIEMENS DE 9,026
- ROBERT BOSCH DE 9,005
- SAMSUNG ELECTRONICS COMPANY KR 6,729
- GUANGDONG POWER GRID CORPORATION 5,740
- DENSO CORPORATION JP 5,077
- LG ELECTRONICS KR 5,041
- LG INNOTEK COMPANY KR 4,442
- TOYOTA MOTOR CORPORATION 4,349