CPC Subgroup
H02K 9/225 Full Title
Arrangements for cooling or ventilating (channels or ducts in parts of the magnetic circuit H02K1/20, H02K1/32; channels or ducts in or between conductors H02K3/22, H02K3/24) > by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
Top Applicants
Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 24,515
- MITSUBISHI ELECTRIC CORPORATION JP 11,346
- SIEMENS DE 9,026
- ROBERT BOSCH DE 9,005
- SAMSUNG ELECTRONICS COMPANY KR 6,729
- GUANGDONG POWER GRID CORPORATION 5,740
- DENSO CORPORATION JP 5,077
- LG ELECTRONICS KR 5,041
- LG INNOTEK COMPANY KR 4,442
- TOYOTA MOTOR CORPORATION 4,349