CPC Subgroup
H02K 9/22 by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
Full Title
Arrangements for cooling or ventilating (channels or ducts in parts of the magnetic circuit H02K1/20, H02K1/32; channels or ducts in or between conductors H02K3/22, H02K3/24) > by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
3 direct subcodes
Child Classifications
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Top Applicants
Top 10 applicants by patent filingsfor class H02, 2013–2023, worldwide · Source: EPO PATSTAT
- SGCC(STATE GRID CORPORATION OF CHINA) 24,515
- MITSUBISHI ELECTRIC CORPORATION JP 11,346
- SIEMENS DE 9,026
- ROBERT BOSCH DE 9,005
- SAMSUNG ELECTRONICS COMPANY KR 6,729
- GUANGDONG POWER GRID CORPORATION 5,740
- DENSO CORPORATION JP 5,077
- LG ELECTRONICS KR 5,041
- LG INNOTEK COMPANY KR 4,442
- TOYOTA MOTOR CORPORATION 4,349