CPC Subgroup Additional Only
H05K 2201/0263 Details about a collection of particles
Full Title
Indexing scheme relating to printed circuits covered by H05K1/00 > Fillers; Particles; Fibers; Reinforcement materials > Fillers and particles > Details about a collection of particles
3 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- H05K 2201/0266 Size distribution
- H05K 2201/0269 Non-uniform distribution or concentration of particles
- H05K 2201/0272 Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907