Indexing scheme relating to printed circuits covered by H05K1/00

Filing statistics

CPC H05K 2201/00 belongs to the parent subclass H05K, which recorded 393,752 patent applications worldwide between 2013 and 2023. Annual filings grew from 26,893 in 2013 to 40,478 in 2023 (+51%), peaking at 44,441 applications in 2021. The most active applicants in class H05 are SAMSUNG ELECTRONICS COMPANY (9,981 applications), SAMSUNG DISPLAY (5,041 applications) and LG ELECTRONICS (4,742 applications).

Source: EPO PATSTAT, worldwide filings

11 direct subcodes

Child Classifications

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H05K 2201/01 Dielectrics
H05K 2201/02 Fillers; Particles; Fibers; Reinforcement materials
H05K 2201/03 Conductive materials
H05K 2201/04 Assemblies of printed circuits
H05K 2201/05 Flexible printed circuits [FPCs]
H05K 2201/06 Thermal details
H05K 2201/07 Electric details
H05K 2201/08 Magnetic details
H05K 2201/09 Shape and layout
H05K 2201/10 Details of components or other objects attached to or integrated in a printed circuit board
H05K 2201/20 Details of printed circuits not provided for in H05K2201/01 - H05K2201/10

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

SAMSUNG ELECTRONICS COMPANY KR 9,981
SAMSUNG DISPLAY KR 5,041
LG ELECTRONICS KR 4,742
PHILIP MORRIS PRODUCTS CH 4,411
PANASONIC INTELLECTUAL PROPERTY JP 3,915
PANASONIC INTELLECTUAL PROPERTY 3,471
SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
MURATA MANUFACTURING COMPANY JP 3,191
FUJI JP 2,987
SIGNIFY HOLDING NL 2,907