CPC Main Group Additional Only
H05K 2201/00 Indexing scheme relating to printed circuits covered by H05K1/00
11 direct subcodes
Child Classifications
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- H05K 2201/01 Dielectrics
- H05K 2201/02 Fillers; Particles; Fibers; Reinforcement materials
- H05K 2201/03 Conductive materials
- H05K 2201/04 Assemblies of printed circuits
- H05K 2201/05 Flexible printed circuits [FPCs]
- H05K 2201/06 Thermal details
- H05K 2201/07 Electric details
- H05K 2201/08 Magnetic details
- H05K 2201/09 Shape and layout
- H05K 2201/10 Details of components or other objects attached to or integrated in a printed circuit board
- H05K 2201/20 Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907