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CPC Subgroup Additional Only
H05K 2201/0302

Properties and characteristics in general

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Conductive materials > Properties and characteristics in general

5 direct subcodes

Child Classifications

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  • H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
  • H05K 2201/0308 Shape memory alloy [SMA]
  • H05K 2201/0311 Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
  • H05K 2201/0314 Elastomeric connector or conductor, e.g. rubber with metallic filler
  • H05K 2201/0317 Thin film conductor layer; Thin film passive component

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907