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CPC Subgroup Additional Only
H05K 2201/04

Assemblies of printed circuits

Full Title

Indexing scheme relating to printed circuits covered by H05K1/00 > Assemblies of printed circuits

9 direct subcodes

Child Classifications

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  • H05K 2201/041 Stacked PCBs, i.e. having neither an empty space nor mounted components in between
  • H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
  • H05K 2201/043 Stacked PCBs with their backs attached to each other without electrical connection
  • H05K 2201/044 Details of backplane or midplane for mounting orthogonal PCBs
  • H05K 2201/045 Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
  • H05K 2201/046 Planar parts of folded PCBs making an angle relative to each other
  • H05K 2201/047 Box-like arrangements of PCBs
  • H05K 2201/048 Second PCB mounted on first PCB by inserting in window or holes of the first PCB
  • H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB

Top Applicants

Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG ELECTRONICS COMPANY KR 9,981
  2. SAMSUNG DISPLAY KR 5,041
  3. LG ELECTRONICS KR 4,742
  4. PHILIP MORRIS PRODUCTS CH 4,411
  5. PANASONIC INTELLECTUAL PROPERTY JP 3,915
  6. PANASONIC INTELLECTUAL PROPERTY 3,471
  7. SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
  8. MURATA MANUFACTURING COMPANY JP 3,191
  9. FUJI JP 2,987
  10. SIGNIFY HOLDING NL 2,907