CPC Subgroup Additional Only
H05K 2201/06 Thermal details
Full Title
Indexing scheme relating to printed circuits covered by H05K1/00 > Thermal details
4 direct subcodes
Child Classifications
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- H05K 2201/062 Means for thermal insulation, e.g. for protection of parts
- H05K 2201/064 Fluid cooling, e.g. by integral pipes
- H05K 2201/066 Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K 2201/068 wherein the coefficient of thermal expansion is important
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907