Substrate related

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Indexing scheme relating to printed circuits covered by H05K1/00 > Shape and layout > Substrate related

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• H05K 2201/09018 Rigid curved substrate
• H05K 2201/09027 Non-rectangular flat PCB, e.g. circular
• H05K 2201/09036 Recesses or grooves in insulating substrate
• H05K 2201/09045 Locally raised area or protrusion of insulating substrate
• H05K 2201/09054 Raised area or protrusion of metal substrate
• H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• H05K 2201/09072 Hole or recess under component or special relationship between hole and component
• H05K 2201/09081 Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
• H05K 2201/0909 Preformed cutting or breaking line
• H05K 2201/091 Locally and permanently deformed areas including dielectric material
• H05K 2201/09109 Locally detached layers, e.g. in multilayer
• H05K 2201/09118 Moulded substrate
• H05K 2201/09127 PCB or component having an integral separable or breakable part
• H05K 2201/09136 Means for correcting warpage