Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809

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Indexing scheme relating to printed circuits covered by H05K1/00 > Shape and layout > Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809

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• H05K 2201/09827 Tapered, e.g. tapered hole, via or groove
• H05K 2201/09836 Oblique hole, via or bump
• H05K 2201/09845 Stepped hole, via, edge, bump or conductor
• H05K 2201/09854 Hole or via having special cross-section, e.g. elliptical
• H05K 2201/09863 Concave hole or via
• H05K 2201/09872 Insulating conformal coating
• H05K 2201/09881 Coating only between conductors, i.e. flush with the conductors
• H05K 2201/0989 Coating free areas, e.g. areas other than pads or lands free of solder resist
• H05K 2201/099 Coating over pads, e.g. solder resist partly over pads
• H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• H05K 2201/09927 Machine readable code, e.g. bar code
• H05K 2201/09936 Marks, inscriptions, etc. for information
• H05K 2201/09945 Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
• H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• H05K 2201/09963 Programming circuit by using small elements, e.g. small PCBs
• H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• H05K 2201/09981 Metallised walls
• H05K 2201/09985 Hollow waveguide combined with printed circuit
• H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing