Patterning and lithography

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Patterning and lithography; Masks; Details of resist > Patterning and lithography

Child Classifications

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• H05K 2203/0505 Double exposure of the same photosensitive layer
• H05K 2203/0508 Flood exposure
• H05K 2203/0511 Diffusion patterning
• H05K 2203/0514 Photodevelopable thick film, e.g. conductive or insulating paste
• H05K 2203/0517 Electrographic patterning
• H05K 2203/052 Magnetographic patterning
• H05K 2203/0522 Using an adhesive pattern
• H05K 2203/0525 Patterning by phototackifying or by photopatterning adhesive
• H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• H05K 2203/0531 Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate
• H05K 2203/0534 Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
• H05K 2203/0537 Transfer of pre-fabricated insulating pattern
• H05K 2203/054 Continuous temporary metal layer over resist, e.g. for selective electroplating
• H05K 2203/0542 Continuous temporary metal layer over metal pattern
• H05K 2203/0545 Pattern for applying drops or paste; Applying a pattern made of drops or paste