CPC Main Group Additional Only
H05K 2203/00 Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
18 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- H05K 2203/01 Tools for processing; Objects used during processing
- H05K 2203/02 Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K 2203/03 Metal processing
- H05K 2203/04 Soldering or other types of metallurgic bonding
- H05K 2203/05 Patterning and lithography; Masks; Details of resist
- H05K 2203/06 Lamination
- H05K 2203/07 Treatments involving liquids, e.g. plating, rinsing
- H05K 2203/08 Treatments involving gases
- H05K 2203/09 Treatments involving charged particles
- H05K 2203/10 Using electric, magnetic and electromagnetic fields; Using laser light
- H05K 2203/11 Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K 2203/12 Using specific substances
- H05K 2203/13 Moulding and encapsulation; Deposition techniques; Protective layers
- H05K 2203/14 Related to the order of processing steps
- H05K 2203/15 Position of the PCB during processing
- H05K 2203/16 Inspection; Monitoring; Aligning
- H05K 2203/17 Post-manufacturing processes
- H05K 2203/30 Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17