Details of resist

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Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Patterning and lithography; Masks; Details of resist > Details of resist

Child Classifications

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• H05K 2203/0565 Resist used only for applying catalyst, not for plating itself
• H05K 2203/0568 Resist used for applying paste, ink or powder
• H05K 2203/0571 Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
• H05K 2203/0574 Stacked resist layers used for different processes
• H05K 2203/0577 Double layer of resist having the same pattern
• H05K 2203/058 Additional resists used for the same purpose but in different areas, i.e. not stacked
• H05K 2203/0582 Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
• H05K 2203/0585 Second resist used as mask for selective stripping of first resist
• H05K 2203/0588 Second resist used as pattern over first resist
• H05K 2203/0591 Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
• H05K 2203/0594 Insulating resist or coating with special shaped edges
• H05K 2203/0597 Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating