CPC Subgroup Additional Only
H05K 2203/06 Lamination
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Lamination
5 direct subcodes
Child Classifications
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- H05K 2203/061 of previously made multilayered subassemblies
- H05K 2203/063 of preperforated insulating layer
- H05K 2203/065 Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
- H05K 2203/066 Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
- H05K 2203/068 Features of the lamination press or of the lamination process, e.g. using special separator sheets
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907