CPC Subgroup Additional Only
H05K 2203/08 Treatments involving gases
Full Title
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Treatments involving gases
7 direct subcodes
Child Classifications
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- H05K 2203/081 Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
- H05K 2203/082 Suction, e.g. for holding solder balls or components
- H05K 2203/083 Evaporation or sublimation of a compound, e.g. gas bubble generating agent
- H05K 2203/085 Using vacuum or low pressure
- H05K 2203/086 Using an inert gas
- H05K 2203/087 Using a reactive gas
- H05K 2203/088 Using a vapour or mist, e.g. cleaning using water vapor
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907