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CPC Subgroup Additional Only
H05K 2203/095

Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Full Title

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Treatments involving charged particles > Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

1 direct subcode

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