Treatments characterised by their effect, e.g. heating, cooling, roughening

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Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 > Treatments characterised by their effect, e.g. heating, cooling, roughening

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• H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• H05K 2203/111 Preheating, e.g. before soldering
• H05K 2203/1115 Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
• H05K 2203/1121 Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
• H05K 2203/1126 Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
• H05K 2203/1131 Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
• H05K 2203/1136 Conversion of insulating material into conductive material, e.g. by pyrolysis
• H05K 2203/1142 Conversion of conductive material into insulating material or into dissolvable compound
• H05K 2203/1147 Sealing or impregnating, e.g. of pores
• H05K 2203/1152 Replicating the surface structure of a sacrificial layer, e.g. for roughening
• H05K 2203/1157 Using means for chemical reduction
• H05K 2203/1163 Chemical reaction, e.g. heating solder by exothermic reaction
• H05K 2203/1168 Graft-polymerization
• H05K 2203/1173 Differences in wettability, e.g. hydrophilic or hydrophobic areas
• H05K 2203/1178 Means for venting or for letting gases escape
• H05K 2203/1184 Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
• H05K 2203/1189 Pressing leads, bumps or a die through an insulating layer
• H05K 2203/1194 Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging