CPC Subgroup
H05K 3/308 Full Title
Apparatus or processes for manufacturing printed circuits > Assembling printed circuits with electric components, e.g. with resistors > with lead-in-hole components (H05K3/32 takes precedence)
Filing statistics
CPC H05K 3/308 belongs to the parent subclass H05K, which recorded 393,752 patent applications worldwide between 2013 and 2023. Annual filings grew from 26,893 in 2013 to 40,478 in 2023 (+51%), peaking at 44,441 applications in 2021. The most active applicants in class H05 are SAMSUNG ELECTRONICS COMPANY (9,981 applications), SAMSUNG DISPLAY (5,041 applications) and LG ELECTRONICS (4,742 applications).
Source: EPO PATSTAT, worldwide filings
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907