CPC Main Group
H05K 3/00 Apparatus or processes for manufacturing printed circuits
20 direct subcodes
Child Classifications
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- H05K 3/02 in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K 3/22 Secondary treatment of printed circuits
- H05K 3/30 Assembling printed circuits with electric components, e.g. with resistors
- H05K 3/36 Assembling printed circuits with other printed circuits
- H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal
- H05K 3/40 Forming printed elements for providing electric connections to or between printed circuits
- H05K 3/44 Manufacturing insulated metal core circuits
- H05K 3/46 Manufacturing multilayer circuits