CPC Main Group
H05K 3/00 Apparatus or processes for manufacturing printed circuits
Filing statistics
CPC H05K 3/00 belongs to the parent subclass H05K, which recorded 393,752 patent applications worldwide between 2013 and 2023. Annual filings grew from 26,893 in 2013 to 40,478 in 2023 (+51%), peaking at 44,441 applications in 2021. The most active applicants in class H05 are SAMSUNG ELECTRONICS COMPANY (9,981 applications), SAMSUNG DISPLAY (5,041 applications) and LG ELECTRONICS (4,742 applications).
Source: EPO PATSTAT, worldwide filings
20 direct subcodes
Child Classifications
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- H05K 3/02 in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K 3/22 Secondary treatment of printed circuits
- H05K 3/30 Assembling printed circuits with electric components, e.g. with resistors
- H05K 3/36 Assembling printed circuits with other printed circuits
- H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal
- H05K 3/40 Forming printed elements for providing electric connections to or between printed circuits
- H05K 3/44 Manufacturing insulated metal core circuits
- H05K 3/46 Manufacturing multilayer circuits
Top Applicants
Top 10 applicants by patent filingsfor class H05, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG ELECTRONICS COMPANY KR 9,981
- SAMSUNG DISPLAY KR 5,041
- LG ELECTRONICS KR 4,742
- PHILIP MORRIS PRODUCTS CH 4,411
- PANASONIC INTELLECTUAL PROPERTY JP 3,915
- PANASONIC INTELLECTUAL PROPERTY 3,471
- SAMSUNG ELECTRO-MECHANICS COMPANY KR 3,210
- MURATA MANUFACTURING COMPANY JP 3,191
- FUJI JP 2,987
- SIGNIFY HOLDING NL 2,907