CPC Main Group
H10B 53/00 Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
5 direct subcodes
Child Classifications
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- H10B 53/10 characterised by the top-view layout
- H10B 53/20 characterised by the three-dimensional [3D] arrangements, e.g. with cells on different height levels
- H10B 53/30 characterised by the memory core region
- H10B 53/40 characterised by the peripheral circuit region
- H10B 53/50 characterised by the boundary region between the core and peripheral circuit regions
Top Applicants
Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 38,446
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
- SAMSUNG ELECTRONICS COMPANY KR 30,059
- BOE TECHNOLOGY GROUP COMPANY CN 20,304
- LG DISPLAY COMPANY KR 17,772
- BOE TECHNOLOGY GROUP COMPANY 15,621
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
- SAMSUNG DISPLAY 11,316
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697