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DIFF Main Group
H10B 53/00

Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors

Introduced: January 2023

IPC and CPC are identically structured here. All 5 subcodes exist in both systems.

IPC defines codes here since 2023.

Child Classifications

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  • H10B 53/10 characterised by the top-view layout since 2023 IPC+CPC Available in IPC and CPC
  • H10B 53/20 characterised by the three-dimensional [3D] arrangements, e.g. with cells on different height levels since 2023 IPC+CPC Available in IPC and CPC
  • H10B 53/30 characterised by the memory core region since 2023 IPC+CPC Available in IPC and CPC
  • H10B 53/40 characterised by the peripheral circuit region since 2023 IPC+CPC Available in IPC and CPC
  • H10B 53/50 characterised by the boundary region between the core and peripheral circuit regions since 2023 IPC+CPC Available in IPC and CPC

Top Applicants

Top Applicants (IPC)

Class H10,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 21,044
  2. SAMSUNG ELECTRONICS COMPANY KR 14,774
  3. LG DISPLAY COMPANY KR 9,454
  4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 8,301
  5. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 7,642
  6. BOE TECHNOLOGY GROUP COMPANY 6,845
  7. BOE TECHNOLOGY GROUP COMPANY CN 6,806
  8. SAMSUNG DISPLAY 6,577
  9. LG CHEM KR 5,461
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 5,115

Top Applicants (CPC)

Class H10,2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 38,446
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
  3. SAMSUNG ELECTRONICS COMPANY KR 30,059
  4. BOE TECHNOLOGY GROUP COMPANY CN 20,304
  5. LG DISPLAY COMPANY KR 17,772
  6. BOE TECHNOLOGY GROUP COMPANY 15,621
  7. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
  8. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
  9. SAMSUNG DISPLAY 11,316
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697