CPC Subgroup
H10N 30/01 Manufacture or treatment
Full Title
Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N39/00) > Manufacture or treatment
8 direct subcodes
Child Classifications
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- H10N 30/02 Forming enclosures or casings
- H10N 30/03 Assembling devices that include piezoelectric or electrostrictive parts
- H10N 30/04 Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N 30/05 Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N 30/06 Forming electrodes or interconnections, e.g. leads or terminals
- H10N 30/07 Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N 30/08 Shaping or machining of piezoelectric or electrostrictive bodies
- H10N 30/09 Forming piezoelectric or electrostrictive materials
Top Applicants
Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT
- SAMSUNG DISPLAY KR 38,446
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
- SAMSUNG ELECTRONICS COMPANY KR 30,059
- BOE TECHNOLOGY GROUP COMPANY CN 20,304
- LG DISPLAY COMPANY KR 17,772
- BOE TECHNOLOGY GROUP COMPANY 15,621
- SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
- IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
- SAMSUNG DISPLAY 11,316
- SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697