Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base

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Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N39/00) > Manufacture or treatment > Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base

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• H10N 30/071 Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
• H10N 30/072 by laminating or bonding of piezoelectric or electrostrictive bodies
• H10N 30/074 by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing