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CPC Subgroup
H10P 32/1404

Full Title

Diffusion of dopants within, into or out of wafers, substrates or parts of devices (during formation of materials H10P14/00) > Diffusion of dopants within, into or out of semiconductor bodies or layers > within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase

1 direct subcode

Child Classifications

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Top Applicants

Top 10 applicants by patent filingsfor class H10, 2013–2023, worldwide · Source: EPO PATSTAT

  1. SAMSUNG DISPLAY KR 38,446
  2. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY TW 30,922
  3. SAMSUNG ELECTRONICS COMPANY KR 30,059
  4. BOE TECHNOLOGY GROUP COMPANY CN 20,304
  5. LG DISPLAY COMPANY KR 17,772
  6. BOE TECHNOLOGY GROUP COMPANY 15,621
  7. SEMICONDUCTOR ENERGY LABORATORY COMPANY JP 13,629
  8. IBM (INTERNATIONAL BUSINESS MACHINES CORPORATION) US 11,750
  9. SAMSUNG DISPLAY 11,316
  10. SEMICONDUCTOR ENERGY LABORATORY COMPANY 9,697