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PCE
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CPC Subgroup
H10P 34/42

with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20)

Full Title

Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices > with high-energy radiation > with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20)

1 direct subcode

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