DIFF Subgroup
H10P 34/42 with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20)
Introduced: January 2026
Title
Titles differ between systems:
IPC: with electromagnetic radiation, e.g. laser annealing
CPC: with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20)
Full Title
Full titles differ between systems:
IPC:
Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices > with high-energy radiation > with electromagnetic radiation, e.g. laser annealing
CPC:
Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices > with high-energy radiation > with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20)
Of 1 combined children, 0 exist in both systems.
1 codes are CPC-only extensions.
Child Classifications
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