CPC Subgroup
H10P 54/90 Auxiliary processes or arrangements
Full Title
Cutting or separating of wafers, substrates or parts of devices > Auxiliary processes or arrangements
2 direct subcodes
Child Classifications
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- H10P 54/92 for protecting or reinforcing the surface of wafers or substrates during cutting or separating, e.g. using adhesive tapes
- H10P 54/94 After-treatments, e.g. removal of adhesive tapes or supports