DIFF Subgroup
H10P 54/90 Auxiliary processes or arrangements
Introduced: January 2026
Full Title
Cutting or separating of wafers, substrates or parts of devices > Auxiliary processes or arrangements
IPC and CPC are identically structured here. All 2 subcodes exist in both systems.
IPC defines codes here since 2026.
Child Classifications
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- H10P 54/92 for protecting or reinforcing the surface of wafers or substrates during cutting or separating, e.g. using adhesive tapes since 2026 +2 CPC IPC+CPC Available in IPC and CPC
- H10P 54/94 After-treatments, e.g. removal of adhesive tapes or supports since 2026 IPC+CPC Available in IPC and CPC