Auxiliary processes or arrangements

Full Title

Cutting or separating of wafers, substrates or parts of devices > Auxiliary processes or arrangements

Classification Context

Section:

ELECTRICITY

Class:

SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

Subclass:

GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS

Child Classifications

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• H10P 54/92 for protecting or reinforcing the surface of wafers or substrates during cutting or separating, e.g. using adhesive tapes
• H10P 54/94 After-treatments, e.g. removal of adhesive tapes or supports