CPC Subgroup
H10P 72/7602 Full Title
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof > for supporting or gripping > using mechanical means, e.g. clamps or pinches
H10P 72/7602 Handling or holding of wafers, substrates or devices during manufacture or treatment thereof > for supporting or gripping > using mechanical means, e.g. clamps or pinches