CPC Subgroup
H10P 72/70 for supporting or gripping
Full Title
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof > for supporting or gripping
4 direct subcodes
Child Classifications
Navigate with arrow keys, Enter to open
- H10P 72/72 using electrostatic chucks
- H10P 72/76 using mechanical means, e.g. clamps or pinches
- H10P 72/78 using vacuum or suction, e.g. Bernoulli chucks