CPC Main Group
H10W 20/00 Interconnections in chips, wafers or substrates
3 direct subcodes
Child Classifications
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- H10W 20/20 Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H10W 20/40 Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes