DIFF Subgroup
B23K 1/002 Soldering by means of induction heating
Introduced: January 1990
Full Title
Full titles differ between systems:
IPC:
Soldering, e.g. brazing, or unsoldering > Soldering by means of induction heating
CPC:
Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) > Soldering by means of induction heating
No child classifications to compare. This is a leaf node in both IPC and CPC.
Top Applicants
Top Applicants (IPC)
Class B23,2013–2023, worldwide · Source: EPO PATSTAT
- ITW (ILLINOIS TOOL WORKS) US 3,407
- FANUC JP 3,120
- DISCO ABRASIVE SYSTEM 2,777
- HAN'S LASER TECHNOLOGY INDUSTRY GROUP COMPANY 2,629
- ROBERT BOSCH DE 2,468
- FANUC 2,273
- DISCO CORPORATION JP 2,267
- GE (GENERAL ELECTRIC COMPANY) US 1,611
- CHINESE ACADEMY OF SCIENCES 1,534
- ISCAR IL 1,499
Top Applicants (CPC)
Class B23,2013–2023, worldwide · Source: EPO PATSTAT
- ITW (ILLINOIS TOOL WORKS) US 3,642
- DISCO CORPORATION JP 3,316
- FANUC JP 3,111
- ROBERT BOSCH DE 2,711
- FANUC 2,163
- GE (GENERAL ELECTRIC COMPANY) US 2,113
- ISCAR IL 1,516
- SIEMENS DE 1,459
- LINCOLN GLOBAL US 1,433
- KOBE STEEL JP 1,423