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PCE
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DIFF Subgroup
B23K 1/018

Unsoldering; Removal of melted solder or other residues

Introduced: January 1990

Full Title

Full titles differ between systems:

IPC:

Soldering, e.g. brazing, or unsoldering > Unsoldering; Removal of melted solder or other residues

CPC:

Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) > Unsoldering; Removal of melted solder or other residues

No child classifications to compare. This is a leaf node in both IPC and CPC.