DIFF Subgroup
B23K 1/018 Unsoldering; Removal of melted solder or other residues
Introduced: January 1990
Full Title
Full titles differ between systems:
IPC:
Soldering, e.g. brazing, or unsoldering > Unsoldering; Removal of melted solder or other residues
CPC:
Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) > Unsoldering; Removal of melted solder or other residues
No child classifications to compare. This is a leaf node in both IPC and CPC.