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DIFF Subgroup
B23K 26/0622

by shaping pulses

Introduced: January 2014

Full Title

Working by laser beam, e.g. welding, cutting or boring > Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam > Shaping the laser beam, e.g. by masks or multi-focusing > by direct control of the laser beam > by shaping pulses

Of 1 combined children, 0 exist in both systems.

1 codes are CPC-only extensions.

Child Classifications

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Top Applicants

Top Applicants (IPC)

Class B23,2013–2023, worldwide · Source: EPO PATSTAT

  1. ITW (ILLINOIS TOOL WORKS) US 3,407
  2. FANUC JP 3,120
  3. DISCO ABRASIVE SYSTEM 2,777
  4. HAN'S LASER TECHNOLOGY INDUSTRY GROUP COMPANY 2,629
  5. ROBERT BOSCH DE 2,468
  6. FANUC 2,273
  7. DISCO CORPORATION JP 2,267
  8. GE (GENERAL ELECTRIC COMPANY) US 1,611
  9. CHINESE ACADEMY OF SCIENCES 1,534
  10. ISCAR IL 1,499

Top Applicants (CPC)

Class B23,2013–2023, worldwide · Source: EPO PATSTAT

  1. ITW (ILLINOIS TOOL WORKS) US 3,642
  2. DISCO CORPORATION JP 3,316
  3. FANUC JP 3,111
  4. ROBERT BOSCH DE 2,711
  5. FANUC 2,163
  6. GE (GENERAL ELECTRIC COMPANY) US 2,113
  7. ISCAR IL 1,516
  8. SIEMENS DE 1,459
  9. LINCOLN GLOBAL US 1,433
  10. KOBE STEEL JP 1,423