DIFF Subgroup
B23K 26/362 Laser etching
Introduced: January 2014
Full Title
Full titles differ between systems:
IPC:
Working by laser beam, e.g. welding, cutting or boring > Removing material > Laser etching
CPC:
Working by laser beam, e.g. welding, cutting or boring > Removing material (B23K26/55, B23K26/57 take precedence) > Laser etching
IPC and CPC are identically structured here. All 1 subcodes exist in both systems.
IPC defines codes here since 2014.
Child Classifications
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- B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove since 2014 IPC+CPC Available in IPC and CPC
Top Applicants
Top Applicants (IPC)
Class B23,2013–2023, worldwide · Source: EPO PATSTAT
- ITW (ILLINOIS TOOL WORKS) US 3,407
- FANUC JP 3,120
- DISCO ABRASIVE SYSTEM 2,777
- HAN'S LASER TECHNOLOGY INDUSTRY GROUP COMPANY 2,629
- ROBERT BOSCH DE 2,468
- FANUC 2,273
- DISCO CORPORATION JP 2,267
- GE (GENERAL ELECTRIC COMPANY) US 1,611
- CHINESE ACADEMY OF SCIENCES 1,534
- ISCAR IL 1,499
Top Applicants (CPC)
Class B23,2013–2023, worldwide · Source: EPO PATSTAT
- ITW (ILLINOIS TOOL WORKS) US 3,642
- DISCO CORPORATION JP 3,316
- FANUC JP 3,111
- ROBERT BOSCH DE 2,711
- FANUC 2,163
- GE (GENERAL ELECTRIC COMPANY) US 2,113
- ISCAR IL 1,516
- SIEMENS DE 1,459
- LINCOLN GLOBAL US 1,433
- KOBE STEEL JP 1,423