DIFF Subgroup
B23K 26/362 Laser etching
Introduced: January 2014
Full Title
Full titles differ between systems:
IPC:
Working by laser beam, e.g. welding, cutting or boring > Removing material > Laser etching
CPC:
Working by laser beam, e.g. welding, cutting or boring > Removing material (B23K26/55, B23K26/57 take precedence) > Laser etching
IPC and CPC are identically structured here. All 1 subcodes exist in both systems.
IPC defines codes here since 2014.
Child Classifications
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- B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove since 2014 IPC+CPC Available in IPC and CPC