DIFF Subgroup
B23K 26/386 of blind holes
Introduced: January 2014
Full Title
Full titles differ between systems:
IPC:
Working by laser beam, e.g. welding, cutting or boring > Removing material > by boring or cutting > by boring > of blind holes
CPC:
Working by laser beam, e.g. welding, cutting or boring > Removing material (B23K26/55, B23K26/57 take precedence) > by boring or cutting > by boring > of blind holes
No child classifications to compare. This is a leaf node in both IPC and CPC.